Analysis of Defect Rate Improvement in The Smartphone Assembly Industry Using SPC and DMAIC Approach

In the current era, business is experiencing very rapid development, one of which smartphone assembly industry. With high demand for smartphones from public, companies will compete to be able produce quality with predetermined standards and specifications. Quality control needed by company maintain products it produces. It known that company's production target 99.50%. However, this has never been achieved due a large number defect smartphones. Based on calculations using SPC DMAIC, most defects are found in line 1 type product B defect, namely LTE test fail. For reason, research carried out study focuses fail defect. The cause main problem machine error. Before repair, %p value was 2.6% after repair restarting every 2 hours, 1%.